Titanium Plates for Copper Recovery from Etching Solutions

Titanium plates for copper recovery from etching solutions are primarily used as cathode substrates in electrolysis. These plates enable high-purity copper deposition while resisting corrosion from highly oxidative media. They can also function as membrane electrolysis separators in PCB micro-etching line regeneration systems, supporting ion-exchange membranes to separate etching solutions and achieve closed-loop recycling.

Brands of Titanium Plates for Copper Recovery from Etching Solutions

DSA® Ti-Cl: Resistant to Cl₂/H₂O₂ corrosion, suitable for high-oxygen environments.

ECL-Ti™: Titanium-tantalum composite plate (0.1% Ta), resists ammonia stress corrosion, designed for alkaline etching solutions.

BTi-ET Series: TA10 titanium-molybdenum alloy substrate, resistant to chlorine-containing etching solutions, 35% lower cost than imported alternatives.

WTM-ER: Laser-microporous surface treatment reduces peeling force to 0.8MPa, improving copper adhesion.

Selection Guide

Highly oxidative environments: DSA® Ti-Cl

Alkaline etching solution recovery: ECL-Ti™

Cost-sensitive projects: BTi-ET (high cost-performance, chloride-resistant)