Home > Recyclable Products > PCB Scrap > IC Packaging Substrate 
DONGSHENG recycles all types of IC packaging substrate, including ABF, BT, ceramic, and metal substrates. Major IC packaging substrate brands include Ibiden, Shinko, Unimicron, and SEMCO. We provide complete eco-friendly dismantling and resource recovery services for waste substrates from these brands.
Type | Base Material | Application Scenarios | Key Recyclables |
FC-BGA | ABF film (Ajinomoto Build-up Film) | High-performance CPUs/GPUs | High gold yield (gold wires + gold plating) |
FCCSP | BT resin/ABF | Mobile chips, memory devices | Gold wire bonding + solder ball alloys |
PBGA | BT resin | Mid-low end processors, comms chips | Gold-plated pins + copper substrate |
Ceramic Substrate | Al₂O₃/AlN (Alumina/Aluminum Nitride) | Military, power modules | Palladium-silver conductors + high-purity aluminum |
Metal Substrate | Copper/aluminum + insulation | LEDs, power modules | Copper layer (>90% purity) |
Richard
Recycler
Joseph
CEO
Wilson
Factory director
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