Silver-plated materials are primarily used in: silver-plated USB interfaces and relay contacts in electronics, PFA-insulated silver-plated wires, and cyanide-free decorative silver plating. Silver-plated materials play an irreplaceable role in high-frequency electronics, high-reliability semiconductor bonding, and high-temperature resistant wires. Compared to gold-plated materials, their value is lower, resulting in naturally lower silver-plated material recycling prices.
Silver-plated layers must avoid sulfur-containing environments (e.g., rubber, exhaust gases) to prevent sulfidation blackening;
Cyanide-free processes require strict control of "alkaline copper underlayer quality in pre-treatment".
Conductivity: Silver-plated layer resistivity 1.6 μΩ·cm.
Hardness: Vickers hardness 100-130 HV.
Thickness range: Decorative coatings 0.1-1 μm, industrial coatings 5-20 μm.
Wire silver plating: -80℃~250℃;
Electronic coatings: ≤150℃.
Environmental compliance: Cyanide-free process with copper ion residue <10mg/L.
The Silver Recycling Page.